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2020-05-11 01:25:02 Upload
Greetings from Mi Community Bangladesh Tech Team. A few days ago, we discussed the first data on the Snapdragon 875 SoC. This information is still one of a kind, so it’s hard to say how reliable it is. Meanwhile, after the announcement of the SoC MediaTek Dimensity 1000+, which is not very clear how it differs from the Dimensity 1000 at all, a MediaTek representative was asked about the company’s future plans.
MediaTek’s response to questions about Qualcomm’s plans to release the Snapdragon 875 chipset ahead of time and the brand’s effort to counter that. MediaTek spokesman said the company will not be absent from the flagship front and will have products coming out at an appropriate time. MediaTek intends to continue to fight Qualcomm in the segment of the top-end SoC.
Qualcomm is a leading mobile chip manufacturer and its current flagship SD865 is doing quite well. Although the reports don’t mention the fabrication process, earlier rumours suggested that the next flagship Snapdragon SoC will be built on a 5nm manufacturing process by TSMC. MediaTek does not compete with the Snapdragon 865. Because the Dimensity 1000, although it was introduced last year is not yet present in no smartphone on the market. However, this does not mean that MediaTek will not recover by next year, because for consumers any such competition is for the good.
A recent leak shows that the Snapdragon 875 uses the codename “SM8350” and will come with the X60 5G modem-RF system. What we do not know is whether Qualcomm will choose to integrate the 5G modem or make it optional. Following current market trends, Qualcomm will most likely follow the embedding route.
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