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Hey Mi Fans! Xiaomi has recently shared some pictures of Mi 9 featuring internal hardware and design. Let's take a proper look at the phone's internal structure! The wireless charging coil and the large heat dissipating graphite plate are accessible once the back cover has been removed.  Underneath the wireless charging coil we can find the logic board. Looks pretty cool, ah?  The fingerprint identification module can be seen in the central lower part of the back, while on the right side you can spot a linear resonant actuator.  This is the back of Mi 9's motherboard, mainly composed by RF and power chips.   The rear camera module, composed of three cameras, sports a quite large 48MP Sony IMX586 sensor.  At the very bottom of Mi 9 there's the Type-C port and audio speaker. Quite large as you can see.   Here is the teardown of Mi 9.  Internal design optimisations and components improvements have been made to give life to Mi 9. If you want to know more about Mi 9, please reply in the comment below! |
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